Design and modeling for 3D ICs and interposers /
Kaydedildi:
| Yazar: | |
|---|---|
| Diğer Yazarlar: | |
| Materyal Türü: | Elektronik Ekitap |
| Dil: | İngilizce |
| Baskı/Yayın Bilgisi: |
Singapore ; Hackensack, New Jersey :
World Scientific Publishing Company,
[2014]
|
| Seri Bilgileri: | WSPC series in advanced integration and packaging ;
v. 2. |
| Konular: | |
| Online Erişim: | An electronic book accessible through the World Wide Web; click to view |
| Etiketler: |
Etiket eklenmemiş, İlk siz ekleyin!
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