Design and modeling for 3D ICs and interposers /
Uloženo v:
| Hlavní autor: | |
|---|---|
| Další autoři: | |
| Médium: | Elektronický zdroj E-kniha |
| Jazyk: | angličtina |
| Vydáno: |
Singapore ; Hackensack, New Jersey :
World Scientific Publishing Company,
[2014]
|
| Edice: | WSPC series in advanced integration and packaging ;
v. 2. |
| Témata: | |
| On-line přístup: | An electronic book accessible through the World Wide Web; click to view |
| Tagy: |
Žádné tagy, Buďte první, kdo vytvoří štítek k tomuto záznamu!
|
Podobné jednotky: Design and modeling for 3D ICs and interposers /
- Engineering systems integration theory, metrics, and methods /
- The engineering design of systems : models and methods /
- Model based systems engineering : fundamentals and methods /
- Simulation and modeling of systems of systems
- Model-based system architecture /
- Modeling and simulation support for system of systems engineering applications /