Electromigration in ULSI interconnections

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Bibliographic Details
Main Author: Tan, Cher Ming, 1959-
Corporate Author: ebrary, Inc
Format: Electronic eBook
Language:English
Published: Hackensack, N.J. : World Scientific, c2010.
Series:International series on advances in solid state electronics and technology.
Subjects:
Online Access:An electronic book accessible through the World Wide Web; click to view
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020 |z 9789814273336 (e-book) 
035 |a (CaPaEBR)ebr10480052 
035 |a (OCoLC)714877548 
040 |a CaPaEBR  |c CaPaEBR 
050 1 4 |a TK7874.76  |b .T36 2010eb 
100 1 |a Tan, Cher Ming,  |d 1959- 
245 1 0 |a Electromigration in ULSI interconnections  |h [electronic resource] /  |c Cher Ming Tan. 
260 |a Hackensack, N.J. :  |b World Scientific,  |c c2010. 
300 |a xix, 291 p. :  |b ill. (some col.), col. port. 
490 1 |a International series on advances in solid state electronics and technology (ASSET) 
504 |a Includes bibliographical references and index. 
533 |a Electronic reproduction.  |b Palo Alto, Calif. :  |c ebrary,  |d 2013.  |n Available via World Wide Web.  |n Access may be limited to ebrary affiliated libraries. 
650 0 |a Integrated circuits  |x Ultra large scale integration. 
650 0 |a Electrodiffusion. 
655 7 |a Electronic books.  |2 local 
710 2 |a ebrary, Inc. 
830 0 |a International series on advances in solid state electronics and technology. 
856 4 0 |u http://site.ebrary.com/lib/daystar/Doc?id=10480052  |z An electronic book accessible through the World Wide Web; click to view 
908 |a 170314 
942 0 0 |c EB 
999 |c 125313  |d 125313