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Handbook of 3D integration. Volume 3, 3D process technology /

Shranjeno v:
Drugi avtorji: Garrou, Philip (Editor), Koyanagi, Mitsumasa (Editor), Ramm, Peter (Editor), Allen, Ricky (Contributor)
Format: Elektronski eKnjiga
Jezik:angleščina
Izdano: Weinheim, Germany : Wiley-VCH, 2014.
Teme:
Integrated circuits.
Integrated circuits > Design and construction.
Silicon.
Three-dimensional imaging.
Electronic books.
Online dostop:An electronic book accessible through the World Wide Web; click to view
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