Handbook of 3D integration. Volume 3, 3D process technology /

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Bibliographic Details
Other Authors:	Garrou, Philip (Editor), Koyanagi, Mitsumasa (Editor), Ramm, Peter (Editor), Allen, Ricky (Contributor)
Format:	Electronic eBook
Language:	English
Published:	Weinheim, Germany : Wiley-VCH, 2014.
Subjects:	Integrated circuits. Integrated circuits > Design and construction. Silicon. Three-dimensional imaging. Electronic books.
Online Access:	An electronic book accessible through the World Wide Web; click to view
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