Handbook of wafer bonding
Gardado en:
| Autor Corporativo: | |
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| Outros autores: | , , |
| Formato: | Electrónico eBook |
| Idioma: | inglés |
| Publicado: |
Weinheim, Germany :
Wiley-VCH,
2012.
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| Subjects: | |
| Acceso en liña: | An electronic book accessible through the World Wide Web; click to view |
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