Handbook of wafer bonding

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Bibliographic Details
Corporate Author:	ebrary, Inc
Other Authors:	Ramm, Peter, Lu, James Jian-Qiang, Taklo, Maaike M. V.
Format:	Electronic eBook
Language:	English
Published:	Weinheim, Germany : Wiley-VCH, 2012.
Subjects:	Semiconductors > Bonding > Handbooks, manuals, etc. Semiconductor wafers. Microelectromechanical systems > Design and construction. Electronic books.
Online Access:	An electronic book accessible through the World Wide Web; click to view
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