Semiconductor packaging materials interaction and reliability /
محفوظ في:
| مؤلف مشترك: | |
|---|---|
| مؤلفون آخرون: | , |
| التنسيق: | الكتروني كتاب الكتروني |
| اللغة: | الإنجليزية |
| منشور في: |
Boca Raton :
CRC Press,
2011.
|
| الموضوعات: | |
| الوصول للمادة أونلاين: | Click to View |
| الوسوم: |
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| 007 | cr cnu|||||||| | ||
| 008 | 101002s2011 flua ob 000 0 eng d | ||
| 020 | |a 9781439862070 |q (electronic bk.) | ||
| 020 | |z 9781439862056 |q (print) | ||
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| 050 | 4 | |a TK7871.85 |b S4675 2011 | |
| 245 | 0 | 0 | |a Semiconductor packaging |h [electronic resource] : |b materials interaction and reliability / |c Andrea Chen, Randy Hsiao-Yu Lo. |
| 260 | |a Boca Raton : |b CRC Press, |c 2011. | ||
| 300 | |a xviii, 187 p. : |b ill. | ||
| 504 | |a Includes bibliographical references. | ||
| 590 | |a Electronic reproduction. Ann Arbor, MI : ProQuest, 2018. Available via World Wide Web. Access may be limited to ProQuest affiliated libraries. | ||
| 650 | 0 | |a Semiconductors |x Reliability. | |
| 650 | 0 | |a Electronic packaging |x Reliability. | |
| 650 | 0 | |a Materials science. | |
| 650 | 0 | |a Electrical engineering. | |
| 655 | 4 | |a Electronic books. | |
| 700 | 1 | |a Chen, Andrea. | |
| 700 | 1 | |a Lo, Randy. | |
| 710 | 2 | |a ProQuest (Firm) | |
| 797 | 2 | |a ProQuest (Firm) | |
| 856 | 4 | 0 | |u http://ebookcentral.proquest.com/lib/daystar-ebooks/detail.action?docID=773636 |z Click to View |
| 999 | |c 238828 |d 238827 | ||