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A one-semester course in modeling of VLSI interconnections /

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Salvato in:
Dettagli Bibliografici
Autore principale: Goel, Ashok K., 1953- (Autore)
Natura: Elettronico eBook
Lingua:inglese
Pubblicazione: New York, [New York] (222 East 46th Street, New York, NY 10017) : Momentum Press, 2015.
Serie:Electronic circuits and semiconductor devices collection.
Soggetti:
Integrated circuits > Very large scale integration > Mathematical models.
VLSI
Integrated Circuits
Interconnections
Copper Interconnections
Propagation Delays
Crosstalk
Modeling
Electromigration
Capacitances
Inductances
Nanotechnology
Accesso online:An electronic book accessible through the World Wide Web; click to view
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Sommario:
  • 1. Introductory concepts
  • 1.1 Metallic interconnections
  • 1.2 Simplified modeling of resistive interconnections as ladder networks
  • 1.3 Propagation modes in a metallic interconnection
  • 1.4 Slow-wave mode
  • 1.5 Propagation delays
  • 2. Modeling of interconnection resistances, capacitances, and inductances
  • 2.1 Interconnection resistance
  • 2.2 Modeling of resistance for a copper interconnection
  • 2.3 Interconnection capacitances
  • 2.4 The Green's function method, Method of images
  • 2.5 Green's function method, Fourier integral approach
  • 2.6 Interconnection inductances
  • 2.7 Inductance extraction using FastHenry
  • 2.8 Approximate equations for capacitances
  • 2.9 Approximate equations for interconnection capacitances and inductances on silicon and GaAs substrates
  • 3. Modeling of interconnection delays
  • 3.1 Metal-insulator-semiconductor microstrip line model of an interconnection
  • 3.2 Transmission line analysis of single-level interconnections
  • 3.3 Transmission line model for multilevel interconnections
  • 3.4 Modeling of parallel and crossing interconnections
  • 3.5 Modeling of very-high-frequency losses in interconnections
  • 3.6 Compact modeling of interconnection delays
  • 3.7 Modeling of active interconnections
  • 4. Modeling of interconnection crosstalk
  • 4.1 Lumped capacitance model
  • 4.2 Coupled multiconductor MIS microstrip line model
  • 4.3 Frequency-domain model analysis of single-level interconnections
  • 4.4 Transmission line analysis of parallel multilevel interconnections
  • 4.5 Compact expressions for crosstalk analysis
  • 5. Modeling of electromigration-induced interconnection failure
  • 5.1 Electromigration factors and mechanism
  • 5.2 Problems caused by electromigration
  • 5.3 Reduction of electromigration
  • 5.4 Measurement of electromigration
  • 5.5 Electromigration in the copper interconnections
  • 5.6 Models of integrated circuit reliability
  • 5.7 Modeling of electromigration due to current pulses
  • 5.8 Guidelines for testing electromigration
  • 6. Other interconnection technologies
  • 6.1 Optical interconnections
  • 6.2 Superconducting interconnections
  • 6.3 Nanotechnology circuit interconnections
  • Appendixes
  • A. Tables of constants
  • B. Method of images
  • C. Method of moments
  • D. Transmission line equations
  • E. Miller's theorem
  • F. Inverse Laplace transformation technique
  • Index.

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