A one-semester course in modeling of VLSI interconnections /
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Natura: | Elettronico eBook |
Lingua: | inglese |
Pubblicazione: |
New York, [New York] (222 East 46th Street, New York, NY 10017) :
Momentum Press,
2015.
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Serie: | Electronic circuits and semiconductor devices collection.
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Soggetti: | |
Accesso online: | An electronic book accessible through the World Wide Web; click to view |
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Sommario:
- 1. Introductory concepts
- 1.1 Metallic interconnections
- 1.2 Simplified modeling of resistive interconnections as ladder networks
- 1.3 Propagation modes in a metallic interconnection
- 1.4 Slow-wave mode
- 1.5 Propagation delays
- 2. Modeling of interconnection resistances, capacitances, and inductances
- 2.1 Interconnection resistance
- 2.2 Modeling of resistance for a copper interconnection
- 2.3 Interconnection capacitances
- 2.4 The Green's function method, Method of images
- 2.5 Green's function method, Fourier integral approach
- 2.6 Interconnection inductances
- 2.7 Inductance extraction using FastHenry
- 2.8 Approximate equations for capacitances
- 2.9 Approximate equations for interconnection capacitances and inductances on silicon and GaAs substrates
- 3. Modeling of interconnection delays
- 3.1 Metal-insulator-semiconductor microstrip line model of an interconnection
- 3.2 Transmission line analysis of single-level interconnections
- 3.3 Transmission line model for multilevel interconnections
- 3.4 Modeling of parallel and crossing interconnections
- 3.5 Modeling of very-high-frequency losses in interconnections
- 3.6 Compact modeling of interconnection delays
- 3.7 Modeling of active interconnections
- 4. Modeling of interconnection crosstalk
- 4.1 Lumped capacitance model
- 4.2 Coupled multiconductor MIS microstrip line model
- 4.3 Frequency-domain model analysis of single-level interconnections
- 4.4 Transmission line analysis of parallel multilevel interconnections
- 4.5 Compact expressions for crosstalk analysis
- 5. Modeling of electromigration-induced interconnection failure
- 5.1 Electromigration factors and mechanism
- 5.2 Problems caused by electromigration
- 5.3 Reduction of electromigration
- 5.4 Measurement of electromigration
- 5.5 Electromigration in the copper interconnections
- 5.6 Models of integrated circuit reliability
- 5.7 Modeling of electromigration due to current pulses
- 5.8 Guidelines for testing electromigration
- 6. Other interconnection technologies
- 6.1 Optical interconnections
- 6.2 Superconducting interconnections
- 6.3 Nanotechnology circuit interconnections
- Appendixes
- A. Tables of constants
- B. Method of images
- C. Method of moments
- D. Transmission line equations
- E. Miller's theorem
- F. Inverse Laplace transformation technique
- Index.