Hermeticity testing of MEMS and microelectronic packages /
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| Main Authors: | , |
|---|---|
| Format: | Electronic eBook |
| Language: | English |
| Published: |
Boston :
Artech House,
[2013]
|
| Series: | Artech House integrated microsystems series.
|
| Subjects: | |
| Online Access: | An electronic book accessible through the World Wide Web; click to view |
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| 020 | |z 9781608075270 (cloth) | ||
| 020 | |z 1608075273 (cloth) | ||
| 020 | |a 9781608075287 (e-book) | ||
| 035 | |a (CaPaEBR)ebr11069355 | ||
| 040 | |a CaPaEBR |b eng |e rda |e pn |c CaPaEBR | ||
| 050 | 1 | 4 | |a TK7875 |b .C67 2013eb |
| 082 | 0 | 4 | |a 621.381 |2 23 |
| 100 | 1 | |a Costello, Suzanne, |e author. | |
| 245 | 1 | 0 | |a Hermeticity testing of MEMS and microelectronic packages / |c Suzanne Costello, Marc P.Y. Desmulliez. |
| 264 | 1 | |a Boston : |b Artech House, |c [2013] | |
| 264 | 4 | |c ©2013 | |
| 300 | |a 1 online resource (197 pages) : |b illustrations. | ||
| 336 | |a text |2 rdacontent | ||
| 337 | |a computer |2 rdamedia | ||
| 338 | |a online resource |2 rdacarrier | ||
| 490 | 1 | |a Integrated microsystems series | |
| 504 | |a Includes bibliographical references and index. | ||
| 505 | 0 | |a Machine generated contents note: References -- pt. 1 Introduction to Hermetic Packages and Leak Types -- 1.The Evolution of Packages, Their Sealing Methods, and Modes of Fabrication -- 1.1.Introduction -- 1.2.The Evolution of Microelectronics and MEMS Packages -- 1.3.MEMS Sealing Techniques and Mode Package Fabrication -- 1.3.1.Materials -- 1.3.2.Sealing Techniques -- 1.4.Summary of MEMS Packaging Materials and Techniques -- References -- 2.Assembly, Packaging, and Environmentally Induced Failures in MEMS -- 2.1.Introduction -- 2.2.Particle Contamination -- 2.3.Thermomechanical Constraints -- 2.3.1.Thermomechanical Constraints in Die Attach -- 2.3.2.Thermomechanical Constraints in Package-Level Encapsulation -- 2.3.3.Thermomechanical Constraints in Wafer-Level Encapsulation -- 2.3.4.Thermomechanical Constraints in Flip-Chip Bonding -- 2.4.Moisture and Gas Absorption -- 2.4.1.Moisture Absorption -- 2.4.2.Barrier Coatings: A Protection Against Moisture Absorption -- 2.4.3.Outgassing -- 2.5.Conclusions: Reliability Demonstration and Accelerated Testing -- References -- 3.Packaging Requirements for Hermeticity -- 3.1.The Need for Hermeticity in MEMS and Microelectronics Packaging -- 3.2.Balancing Maximum Permissive Leak Rate and Packaging Costs: The Quasi-Hermetic Package -- References -- 4.The Different Types of Leaks in MEMS and Microelectronics Packaging -- 4.1.Introduction -- 4.2.Leak Channels or Capillary Leaks -- 4.3.Permeation -- 4.4.Outgassing -- 4.5.Conclusion -- References -- pt. 2 Traditional Hermeticity Test Techniques and Standards -- 5.Ex Situ Hermeticity Test Methods -- 5.1.Introduction -- 5.2.Fine Leak Tests -- 5.2.1.Helium Fine Leak Test -- 5.2.2.Radioisotope Leak Detection Method -- 5.3.Gross Leak Tests -- 5.3.1.Fluorocarbon Liquid and Vapor Gross Leak Detection -- 5.3.2.Gross Bubble Test -- 5.3.3.Weight Gain -- 5.3.4.Dye Penetrant Gross Leak Test -- 5.4.Combinational Tests -- 5.4.1.Optical Fine/Gross Leak Detection Method -- 5.4.2.Cumulative Helium Leak Detection (CHLD) Method -- References -- 6.The History of Hermeticity Standards MIL-STD-883 T.M. 1014 and MIL-STD-750 T.M. 1071 -- 6.1.Introduction: The First Hermeticity Tests -- 6.2.The Introduction of the Military Standards -- 6.3.The First Problems with Traditional Hermeticity Tests and Standards -- 6.4.Military Standard Revisions -- 6.5.Summary -- References -- pt. 3 Limitations of Existing Hermeticity Test Methods in Low Volume Packages -- 7.Permeation -- 7.1.Introduction -- 7.2.Mathematics of Permeation -- 7.3.Limitations of the Packaging Material -- 7.4.Conclusions -- References -- 8.Outgassing and Residual Gas Analysis (RGA) -- 8.1.Outgassing -- 8.2.Residual Gas Analysis -- References -- 9.Low-Cavity Volume Capillary Leak Limitations -- 9.1.Limitations of the Helium Fine Leak Test Method -- 9.1.1.Volume Limitations -- 9.1.2.Minimum Detectable Leak Rate -- References -- pt. 4 Novel Methods of Leak Detection -- 10.Q-Factor Monitoring of Resonant Microstructures as a Hermeticity Measurement Method -- 10.1.Introduction -- 10.2.Lumped Element Modeling of a Microresonator -- 10.3.Definitions and Measurement Methods of the Quality Factor Q -- 10.3.1.Definition in Terms of Stored Energy -- 10.3.2.Definition in Terms of Bandwidth -- 10.3.3.Determination of the Q-Factor by Amplitude-Frequency Measurement -- 10.3.4.Determination of the Q-Factor by Phase Measurement -- 10.4.Relation Between Pressure and Q-Factor -- References -- 11.In Situ Test Methods in Development -- 11.1.Introduction -- 11.2.Copper Test Structures -- 11.3.Micro-Pirani Gauge -- References -- 12.Ex Situ Hermeticity Test Methods in Development -- 12.1.Introduction -- 12.2.FTIR Spectroscopy -- 12.2.1.Application to Hermeticity -- 12.2.2.Theoretical Limitations -- 12.2.3.Practical Considerations -- 12.2.4.Summary -- 12.3.Raman Spectroscopy -- 12.3.1.Application to the Hermeticity Test -- 12.3.2.Theoretical Limitations -- 12.3.3.Practical Considerations -- 12.3.4.Summary -- References -- pt. 5 Conclusions and Vision -- 13.Summary of Hermeticity Test Methods -- 14.The Way Forward -- 14.1.Introduction -- 14.2.Improvement on Existing Techniques -- 14.3.New Hermetic Materials and Hermeticity Test Methods -- 14.4.Conclusions -- References. | |
| 588 | |a Description based on print version record. | ||
| 590 | |a Electronic reproduction. Palo Alto, Calif. : ebrary, 2015. Available via World Wide Web. Access may be limited to ebrary affiliated libraries. | ||
| 650 | 0 | |a Microelectromechanical systems. | |
| 650 | 0 | |a Microelectronics. | |
| 650 | 0 | |a Microelectromechanical systems |x Testing. | |
| 650 | 0 | |a Microelectronics |x Testing. | |
| 655 | 0 | |a Electronic books. | |
| 700 | 1 | |a Desmulliez, Marc P. Y., |d 1963- |e author. | |
| 797 | 2 | |a ebrary. | |
| 830 | 0 | |a Artech House integrated microsystems series. | |
| 856 | 4 | 0 | |u http://site.ebrary.com/lib/daystar/Doc?id=11069355 |z An electronic book accessible through the World Wide Web; click to view |
| 908 | |a 170314 | ||
| 942 | 0 | 0 | |c EB |
| 999 | |c 183651 |d 183651 | ||