Design and modeling for 3D ICs and interposers /
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| Glavni avtor: | |
|---|---|
| Drugi avtorji: | |
| Format: | Elektronski eKnjiga |
| Jezik: | angleščina |
| Izdano: |
Singapore ; Hackensack, New Jersey :
World Scientific Publishing Company,
[2014]
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| Serija: | WSPC series in advanced integration and packaging ;
v. 2. |
| Teme: | |
| Online dostop: | An electronic book accessible through the World Wide Web; click to view |
| Oznake: |
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