Design and modeling for 3D ICs and interposers /
Guardado en:
| Autor principal: | |
|---|---|
| Otros Autores: | |
| Formato: | Electrónico eBook |
| Lenguaje: | inglés |
| Publicado: |
Singapore ; Hackensack, New Jersey :
World Scientific Publishing Company,
[2014]
|
| Colección: | WSPC series in advanced integration and packaging ;
v. 2. |
| Materias: | |
| Acceso en línea: | An electronic book accessible through the World Wide Web; click to view |
| Etiquetas: |
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