Handbook of wafer bonding
Saved in:
| 企業作者: | |
|---|---|
| 其他作者: | , , |
| 格式: | 電子 電子書 |
| 語言: | 英语 |
| 出版: |
Weinheim, Germany :
Wiley-VCH,
2012.
|
| 主題: | |
| 在線閱讀: | An electronic book accessible through the World Wide Web; click to view |
| 標簽: |
沒有標簽, 成為第一個標記此記錄!
|
MARC
| LEADER | 00000nam a2200000 a 4500 | ||
|---|---|---|---|
| 001 | 0000145233 | ||
| 005 | 20171002061950.0 | ||
| 006 | m u | ||
| 007 | cr cn||||||||| | ||
| 008 | 120218s2012 gw a sbf 001 0 eng d | ||
| 020 | |z 9783527326464 | ||
| 020 | |z 9783527644247 (e-book) | ||
| 035 | |a (CaPaEBR)ebr10529302 | ||
| 035 | |a (OCoLC)779616373 | ||
| 040 | |a CaPaEBR |c CaPaEBR | ||
| 050 | 1 | 4 | |a TK7871.85 |b .H36 2012eb |
| 245 | 0 | 0 | |a Handbook of wafer bonding |h [electronic resource] / |c edited by Peter Ramm, James Jian-Qiang Lu, and Maaike M.V. Taklo. |
| 260 | |a Weinheim, Germany : |b Wiley-VCH, |c 2012. | ||
| 300 | |a xxxi, 395 p. : |b col. ill. | ||
| 504 | |a Includes bibliographical references and index. | ||
| 505 | 0 | |a pt. 1. Technologies -- pt. 2. Applications. | |
| 533 | |a Electronic reproduction. |b Palo Alto, Calif. : |c ebrary, |d 2011. |n Available via World Wide Web. |n Access may be limited to ebrary affiliated libraries. | ||
| 650 | 0 | |a Semiconductors |x Bonding |v Handbooks, manuals, etc. | |
| 650 | 0 | |a Semiconductor wafers. | |
| 650 | 0 | |a Microelectromechanical systems |x Design and construction. | |
| 655 | 7 | |a Electronic books. |2 local | |
| 700 | 1 | |a Ramm, Peter. | |
| 700 | 1 | |a Lu, James Jian-Qiang. | |
| 700 | 1 | |a Taklo, Maaike M. V. | |
| 710 | 2 | |a ebrary, Inc. | |
| 856 | 4 | 0 | |u http://site.ebrary.com/lib/daystar/Doc?id=10529302 |z An electronic book accessible through the World Wide Web; click to view |
| 908 | |a 170314 | ||
| 942 | 0 | 0 | |c EB |
| 999 | |c 134382 |d 134382 | ||