11th international congress molded interconnect devices : scientific proceedings : selected, peer reviewed papers from the 11th International Congress Molded Interconnect Devices (MID 2014), September 24-25, 2014, Nuremberg / Fuerth, Germany /

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Bibliografiske detaljer
Institution som forfatter: International Congress Molded Interconnect Devices Nuremberg / Fuerth, Germany
Andre forfattere: Franke, Jörg (Editor)
Format: Electronisk Conference Proceeding eBog
Sprog:engelsk
Udgivet: Pfaffikon, Switzerland : TTP, 2014.
Serier:Advanced materials research ; Volume 1038.
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Online adgang:An electronic book accessible through the World Wide Web; click to view
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