11th international congress molded interconnect devices : scientific proceedings : selected, peer reviewed papers from the 11th International Congress Molded Interconnect Devices (MID 2014), September 24-25, 2014, Nuremberg / Fuerth, Germany /
I tiakina i:
| Kaituhi rangatōpū: | |
|---|---|
| Ētahi atu kaituhi: | |
| Hōputu: | Tāhiko Mauhanga Hui īPukapuka |
| Reo: | Ingarihi |
| I whakaputaina: |
Pfaffikon, Switzerland :
TTP,
2014.
|
| Rangatū: | Advanced materials research ;
Volume 1038. |
| Ngā marau: | |
| Urunga tuihono: | An electronic book accessible through the World Wide Web; click to view |
| Ngā Tūtohu: |
Tāpirihia he Tūtohu
Kāore He Tūtohu, Me noho koe te mea tuatahi ki te tūtohu i tēnei pūkete!
|
Me noho koe te mea tuatahi ki te waiho tākupu!