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Handbook of wafer bonding

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Detalles Bibliográficos
Autor Corporativo:	ebrary, Inc
Outros autores:	Ramm, Peter, Lu, James Jian-Qiang, Taklo, Maaike M. V.
Formato:	Electrónico eBook
Idioma:	inglés
Publicado:	Weinheim, Germany : Wiley-VCH, 2012.
Subjects:	Semiconductors > Bonding > Handbooks, manuals, etc. Semiconductor wafers. Microelectromechanical systems > Design and construction. Electronic books.
Acceso en liña:	An electronic book accessible through the World Wide Web; click to view
Tags:	Engadir etiqueta Sen Etiquetas, Sexa o primeiro en etiquetar este rexistro!

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