Handbook of wafer bonding
Gorde:
| Erakunde egilea: | |
|---|---|
| Beste egile batzuk: | , , |
| Formatua: | Baliabide elektronikoa eBook |
| Hizkuntza: | ingelesa |
| Argitaratua: |
Weinheim, Germany :
Wiley-VCH,
2012.
|
| Gaiak: | |
| Sarrera elektronikoa: | An electronic book accessible through the World Wide Web; click to view |
| Etiketak: |
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