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Handbook of wafer bonding

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Dades bibliogràfiques
Autor corporatiu:	ebrary, Inc
Altres autors:	Ramm, Peter, Lu, James Jian-Qiang, Taklo, Maaike M. V.
Format:	Electrònic eBook
Idioma:	anglès
Publicat:	Weinheim, Germany : Wiley-VCH, 2012.
Matèries:	Semiconductors > Bonding > Handbooks, manuals, etc. Semiconductor wafers. Microelectromechanical systems > Design and construction. Electronic books.
Accés en línia:	An electronic book accessible through the World Wide Web; click to view
Etiquetes:	Afegir etiqueta Sense etiquetes, Sigues el primer a etiquetar aquest registre!

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