Portable consumer electronics packaging, materials, and reliability /

Gelijkaardige items

• Microwave and millimeter-wave electronic packaging /
  door: Sturdivant, Rick
  Gepubliceerd in: (2014)
• Modeling and simulation for microelectronic packaging assembly manufacturing, reliability and testing /
  door: Liu, S. (Sheng), 1963-
  Gepubliceerd in: (2011)
• Lead-free solder interconnect reliability
  Gepubliceerd in: (2005)
• Adhesion in microelectronics /
  Gepubliceerd in: (2014)
• Materials for high-density electronic packaging and interconnection report of the Committee on Materials for High-Density Electronic Packaging, National Materials Advisory Board, Commission on Engineering and Technical Systems, National Research Council.
  Gepubliceerd in: (1990)