Advanced manufacturing process, lead free interconnect materials and reliability modeling for electronics packaging
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Corporate Author: | ebrary, Inc |
---|---|
Other Authors: | Bailey, Christopher, Liu, Johan |
Format: | Electronic eBook |
Language: | English |
Published: |
Bradford, England :
Emerald Group Publishing,
c2006.
|
Series: | Soldering & surface mount technology ;
v.18, no. 2 |
Subjects: | |
Online Access: | An electronic book accessible through the World Wide Web; click to view |
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