Adhesion in microelectronics /
Saved in:
| Other Authors: | , |
|---|---|
| Format: | Electronic eBook |
| Language: | English |
| Published: |
Hoboken, New Jersey ; Salem, Massachusetts :
Scrivener Publishing : Wiley,
2014.
|
| Series: | Adhesion and adhesives. Fundamental and applied aspects.
|
| Subjects: | |
| Online Access: | An electronic book accessible through the World Wide Web; click to view |
| Tags: |
Add Tag
No Tags, Be the first to tag this record!
|
Add Tag 
Modeling and simulation for microelectronic packaging assembly manufacturing, reliability and testing /
