Cost analysis of electronic systems
Сохранить в:
| Главный автор: | |
|---|---|
| Соавтор: | |
| Формат: | Электронный ресурс eКнига |
| Язык: | английский |
| Опубликовано: |
Singapore ; Hackensack, NJ :
World Scientific Pub.,
c2013.
|
| Серии: | WSPC series in advanced integration and packaging ;
vol. 1 |
| Предметы: | |
| Online-ссылка: | An electronic book accessible through the World Wide Web; click to view |
| Метки: |
Добавить метку
Нет меток, Требуется 1-ая метка записи!
|
Схожие документы
Cost analysis of electronic systems
по: Sandborn, Peter
Опубликовано: (2013)
по: Sandborn, Peter
Опубликовано: (2013)
Failure analysis a practical guide for manufacturers of electronic components and systems /
по: Bâzu, M. I. (Marius I.), 1948-
Опубликовано: (2011)
по: Bâzu, M. I. (Marius I.), 1948-
Опубликовано: (2011)
Failure analysis a practical guide for manufacturers of electronic components and systems /
по: Bâzu, M. I. (Marius I.), 1948-
Опубликовано: (2011)
по: Bâzu, M. I. (Marius I.), 1948-
Опубликовано: (2011)
Reliability technology principles and practice of failure prevention in electronic systems /
по: Pascoe, Norman
Опубликовано: (2011)
по: Pascoe, Norman
Опубликовано: (2011)
Reliability technology principles and practice of failure prevention in electronic systems /
по: Pascoe, Norman
Опубликовано: (2011)
по: Pascoe, Norman
Опубликовано: (2011)
High temperature electronics design for aero engine controls and health monitoring /
по: Stoica, Lucian, и др.
Опубликовано: (2016)
по: Stoica, Lucian, и др.
Опубликовано: (2016)
High temperature electronics design for aero engine controls and health monitoring /
по: Stoica, Lucian, и др.
Опубликовано: (2016)
по: Stoica, Lucian, и др.
Опубликовано: (2016)
Materials for high-density electronic packaging and interconnection report of the Committee on Materials for High-Density Electronic Packaging, National Materials Advisory Board, Commission on Engineering and Technical Systems, National Research Council.
Опубликовано: (1990)
Опубликовано: (1990)
Materials for high-density electronic packaging and interconnection report of the Committee on Materials for High-Density Electronic Packaging, National Materials Advisory Board, Commission on Engineering and Technical Systems, National Research Council.
Опубликовано: (1990)
Опубликовано: (1990)
Electronic components and processes
по: Maheshwari, Preeti
Опубликовано: (2006)
по: Maheshwari, Preeti
Опубликовано: (2006)
Electronic components and processes
по: Maheshwari, Preeti
Опубликовано: (2006)
по: Maheshwari, Preeti
Опубликовано: (2006)
Electronic devices : a text and software problems manual /
по: Schultz, Mitchel E.
Опубликовано: (1994)
по: Schultz, Mitchel E.
Опубликовано: (1994)
Electronic devices : a text and software problems manual /
по: Schultz, Mitchel E.
Опубликовано: (1994)
по: Schultz, Mitchel E.
Опубликовано: (1994)
Electronic devices and amplifier circuits with MATLABʼ / Simulinkʼ / SimElectronics ʼ examples
по: Karris, Steven T.
Опубликовано: (2012)
по: Karris, Steven T.
Опубликовано: (2012)
Electronic devices and amplifier circuits with MATLABʼ / Simulinkʼ / SimElectronics ʼ examples
по: Karris, Steven T.
Опубликовано: (2012)
по: Karris, Steven T.
Опубликовано: (2012)
Polymers for electronic components a Rapra industry analysis report /
по: Cousins, Keith
Опубликовано: (2001)
по: Cousins, Keith
Опубликовано: (2001)
Polymers for electronic components a Rapra industry analysis report /
по: Cousins, Keith
Опубликовано: (2001)
по: Cousins, Keith
Опубликовано: (2001)
Guide to state-of-the-art electron devices
Опубликовано: (2013)
Опубликовано: (2013)
Guide to state-of-the-art electron devices
Опубликовано: (2013)
Опубликовано: (2013)
Portable consumer electronics packaging, materials, and reliability /
по: Canumalla, Sridhar
Опубликовано: (2010)
по: Canumalla, Sridhar
Опубликовано: (2010)
Portable consumer electronics packaging, materials, and reliability /
по: Canumalla, Sridhar
Опубликовано: (2010)
по: Canumalla, Sridhar
Опубликовано: (2010)
Terrestrial radiation effects in ULSI devices and electronic systems /
по: Ibe, Eishi H.
Опубликовано: (2015)
по: Ibe, Eishi H.
Опубликовано: (2015)
Terrestrial radiation effects in ULSI devices and electronic systems /
по: Ibe, Eishi H.
Опубликовано: (2015)
по: Ibe, Eishi H.
Опубликовано: (2015)
Advanced manufacturing process, lead free interconnect materials and reliability modeling for electronics packaging
Опубликовано: (2006)
Опубликовано: (2006)
Advanced manufacturing process, lead free interconnect materials and reliability modeling for electronics packaging
Опубликовано: (2006)
Опубликовано: (2006)
Radiation effects and soft errors in integrated circuits and electronic devices
Опубликовано: (2004)
Опубликовано: (2004)
Radiation effects and soft errors in integrated circuits and electronic devices
Опубликовано: (2004)
Опубликовано: (2004)
Novel architectures for flexible electrochemical devices and systems
по: Kawahara, Jun
Опубликовано: (2013)
по: Kawahara, Jun
Опубликовано: (2013)
Novel architectures for flexible electrochemical devices and systems
по: Kawahara, Jun
Опубликовано: (2013)
по: Kawahara, Jun
Опубликовано: (2013)
Hertzian tales electronic products, aesthetic experience, and critical design /
по: Dunne, Anthony
Опубликовано: (2005)
по: Dunne, Anthony
Опубликовано: (2005)
Hertzian tales electronic products, aesthetic experience, and critical design /
по: Dunne, Anthony
Опубликовано: (2005)
по: Dunne, Anthony
Опубликовано: (2005)
Boundary-scan interconnect diagnosis
по: Sousa, José T. de
Опубликовано: (2001)
по: Sousa, José T. de
Опубликовано: (2001)
Boundary-scan interconnect diagnosis
по: Sousa, José T. de
Опубликовано: (2001)
по: Sousa, José T. de
Опубликовано: (2001)
Designing the internet of things /
по: McEwen, Adrian
Опубликовано: (2014)
по: McEwen, Adrian
Опубликовано: (2014)
Designing the internet of things /
по: McEwen, Adrian
Опубликовано: (2014)
по: McEwen, Adrian
Опубликовано: (2014)
Microwave and millimeter-wave electronic packaging /
по: Sturdivant, Rick
Опубликовано: (2014)
по: Sturdivant, Rick
Опубликовано: (2014)