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Modeling and simulation for microelectronic packaging assembly manufacturing, reliability and testing /

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"This book is primarily concerned with studies of electronic packaging in assembly manufacture processes and failure mechanisms in assembly manufacture processes and tests through modeling and simulation"--

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Bibliographic Details
Main Author: Liu, S. (Sheng), 1963-
Corporate Author: ebrary, Inc
Other Authors: Liu, Yong, 1962-
Format: Electronic eBook
Language:English
Published: Hoboken, N.J. : Wiley, 2011.
Subjects:
Microelectronic packaging > Simulation methods.
Electronic books.
Online Access:An electronic book accessible through the World Wide Web; click to view
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