11th international congress molded interconnect devices : scientific proceedings : selected, peer reviewed papers from the 11th International Congress Molded Interconnect Devices (MID 2014), September 24-25, 2014, Nuremberg / Fuerth, Germany /

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Detaylı Bibliyografya
Müşterek Yazar:	International Congress Molded Interconnect Devices Nuremberg / Fuerth, Germany
Diğer Yazarlar:	Franke, Jörg (Editör)
Materyal Türü:	Elektronik Konferans Sunumu Ekitap
Dil:	İngilizce
Baskı/Yayın Bilgisi:	Pfaffikon, Switzerland : TTP, 2014.
Seri Bilgileri:	Advanced materials research ; Volume 1038.
Konular:	Molded interconnect devices. Three-dimensional display systems > Congresses. Electronic books.
Online Erişim:	An electronic book accessible through the World Wide Web; click to view
Etiketler:	Etiketle Etiket eklenmemiş, İlk siz ekleyin!

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