11th international congress molded interconnect devices : scientific proceedings : selected, peer reviewed papers from the 11th International Congress Molded Interconnect Devices (MID 2014), September 24-25, 2014, Nuremberg / Fuerth, Germany /
Gorde:
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Beste egile batzuk: | |
Formatua: | Baliabide elektronikoa Konferentzia-aktak eBook |
Hizkuntza: | ingelesa |
Argitaratua: |
Pfaffikon, Switzerland :
TTP,
2014.
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Saila: | Advanced materials research ;
Volume 1038. |
Gaiak: | |
Sarrera elektronikoa: | An electronic book accessible through the World Wide Web; click to view |
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