11th international congress molded interconnect devices : scientific proceedings : selected, peer reviewed papers from the 11th International Congress Molded Interconnect Devices (MID 2014), September 24-25, 2014, Nuremberg / Fuerth, Germany /

Shranjeno v:
Bibliografske podrobnosti
Korporativna značnica: International Congress Molded Interconnect Devices Nuremberg / Fuerth, Germany
Drugi avtorji: Franke, Jörg (Editor)
Format: Elektronski Conference Proceeding eKnjiga
Jezik:angleščina
Izdano: Pfaffikon, Switzerland : TTP, 2014.
Serija:Advanced materials research ; Volume 1038.
Teme:
Online dostop:An electronic book accessible through the World Wide Web; click to view
Oznake: Označite
Brez oznak, prvi označite!