11th international congress molded interconnect devices : scientific proceedings : selected, peer reviewed papers from the 11th International Congress Molded Interconnect Devices (MID 2014), September 24-25, 2014, Nuremberg / Fuerth, Germany /
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| Coauteur: | |
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| Andere auteurs: | |
| Formaat: | Elektronisch Conferentie akten E-boek |
| Taal: | Engels |
| Gepubliceerd in: |
Pfaffikon, Switzerland :
TTP,
2014.
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| Reeks: | Advanced materials research ;
Volume 1038. |
| Onderwerpen: | |
| Online toegang: | An electronic book accessible through the World Wide Web; click to view |
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