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11th international congress molded interconnect devices : scientific proceedings : selected, peer reviewed papers from the 11th International Congress Molded Interconnect Devices (MID 2014), September 24-25, 2014, Nuremberg / Fuerth, Germany /

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Detalles Bibliográficos
Autor Corporativo: International Congress Molded Interconnect Devices Nuremberg / Fuerth, Germany
Outros autores: Franke, Jörg (Editor)
Formato: Electrónico Conference Proceeding eBook
Idioma:inglés
Publicado: Pfaffikon, Switzerland : TTP, 2014.
Series:Advanced materials research ; Volume 1038.
Subjects:
Molded interconnect devices.
Three-dimensional display systems > Congresses.
Electronic books.
Acceso en liña:An electronic book accessible through the World Wide Web; click to view
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