11th international congress molded interconnect devices : scientific proceedings : selected, peer reviewed papers from the 11th International Congress Molded Interconnect Devices (MID 2014), September 24-25, 2014, Nuremberg / Fuerth, Germany /

Wedi'i Gadw mewn:
Manylion Llyfryddiaeth
Awdur Corfforaethol: International Congress Molded Interconnect Devices Nuremberg / Fuerth, Germany
Awduron Eraill: Franke, Jörg (Golygydd)
Fformat: Electronig Trafodyn Cynhadledd eLyfr
Iaith:Saesneg
Cyhoeddwyd: Pfaffikon, Switzerland : TTP, 2014.
Cyfres:Advanced materials research ; Volume 1038.
Pynciau:
Mynediad Ar-lein:An electronic book accessible through the World Wide Web; click to view
Tagiau: Ychwanegu Tag
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