11th international congress molded interconnect devices : scientific proceedings : selected, peer reviewed papers from the 11th International Congress Molded Interconnect Devices (MID 2014), September 24-25, 2014, Nuremberg / Fuerth, Germany /

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Bibliographic Details
Corporate Author:	International Congress Molded Interconnect Devices Nuremberg / Fuerth, Germany
Other Authors:	Franke, Jörg (Editor)
Format:	Electronic Conference Proceeding eBook
Language:	English
Published:	Pfaffikon, Switzerland : TTP, 2014.
Series:	Advanced materials research ; Volume 1038.
Subjects:	Molded interconnect devices. Three-dimensional display systems > Congresses. Electronic books.
Online Access:	An electronic book accessible through the World Wide Web; click to view
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