11th international congress molded interconnect devices : scientific proceedings : selected, peer reviewed papers from the 11th International Congress Molded Interconnect Devices (MID 2014), September 24-25, 2014, Nuremberg / Fuerth, Germany /

Furkejuvvon:
Bibliográfalaš dieđut
Searvvušdahkki: International Congress Molded Interconnect Devices Nuremberg / Fuerth, Germany
Eará dahkkit: Franke, Jörg (Doaimmaheaddji)
Materiálatiipa: Elektrovnnalaš Konfereansapublikašuvdna E-girji
Giella:eaŋgalasgiella
Almmustuhtton: Pfaffikon, Switzerland : TTP, 2014.
Ráidu:Advanced materials research ; Volume 1038.
Fáttát:
Liŋkkat:An electronic book accessible through the World Wide Web; click to view
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Govvádus
Olgguldas hápmi:1 online resource (119 pages) : illustrations.
Bibliografiija:Includes bibliographical references at the end of each chapters and index.
ISBN:9783038266365 (e-book)
ISSN:1662-8985 ;
1662-8985