11th international congress molded interconnect devices : scientific proceedings : selected, peer reviewed papers from the 11th International Congress Molded Interconnect Devices (MID 2014), September 24-25, 2014, Nuremberg / Fuerth, Germany /

Gorde:
Xehetasun bibliografikoak
Erakunde egilea: International Congress Molded Interconnect Devices Nuremberg / Fuerth, Germany
Beste egile batzuk: Franke, Jörg (Argitaratzailea)
Formatua: Baliabide elektronikoa Konferentzia-aktak eBook
Hizkuntza:ingelesa
Argitaratua: Pfaffikon, Switzerland : TTP, 2014.
Saila:Advanced materials research ; Volume 1038.
Gaiak:
Sarrera elektronikoa:An electronic book accessible through the World Wide Web; click to view
Etiketak: Etiketa erantsi
Etiketarik gabe, Izan zaitez lehena erregistro honi etiketa jartzen!
Deskribapena
Deskribapen fisikoa:1 online resource (119 pages) : illustrations.
Bibliografia:Includes bibliographical references at the end of each chapters and index.
ISBN:9783038266365 (e-book)
ISSN:1662-8985 ;
1662-8985