International Congress Molded Interconnect Devices Nuremberg / Fuerth, Germany, & Franke, J. (2014). 11th international congress molded interconnect devices: Scientific proceedings : selected, peer reviewed papers from the 11th International Congress Molded Interconnect Devices (MID 2014), September 24-25, 2014, Nuremberg / Fuerth, Germany. TTP.
Trích dẫn kiểu Chicago (xuất bản lần thứ 7)International Congress Molded Interconnect Devices Nuremberg / Fuerth, Germany, và Jörg Franke. 11th International Congress Molded Interconnect Devices: Scientific Proceedings : Selected, Peer Reviewed Papers from the 11th International Congress Molded Interconnect Devices (MID 2014), September 24-25, 2014, Nuremberg / Fuerth, Germany. Pfaffikon, Switzerland: TTP, 2014.
Trích dẫn kiểu MLA (xuất bản lần thứ 9)International Congress Molded Interconnect Devices Nuremberg / Fuerth, Germany, và Jörg Franke. 11th International Congress Molded Interconnect Devices: Scientific Proceedings : Selected, Peer Reviewed Papers from the 11th International Congress Molded Interconnect Devices (MID 2014), September 24-25, 2014, Nuremberg / Fuerth, Germany. TTP, 2014.