APA (7. basım) Alıntı

International Congress Molded Interconnect Devices Nuremberg / Fuerth, Germany, & Franke, J. (2014). 11th international congress molded interconnect devices: Scientific proceedings : selected, peer reviewed papers from the 11th International Congress Molded Interconnect Devices (MID 2014), September 24-25, 2014, Nuremberg / Fuerth, Germany. TTP.

Chicago Style (17. basım) Atıf

International Congress Molded Interconnect Devices Nuremberg / Fuerth, Germany, ve Jörg Franke. 11th International Congress Molded Interconnect Devices: Scientific Proceedings : Selected, Peer Reviewed Papers from the 11th International Congress Molded Interconnect Devices (MID 2014), September 24-25, 2014, Nuremberg / Fuerth, Germany. Pfaffikon, Switzerland: TTP, 2014.

MLA (9th ed.) Atıf

International Congress Molded Interconnect Devices Nuremberg / Fuerth, Germany, ve Jörg Franke. 11th International Congress Molded Interconnect Devices: Scientific Proceedings : Selected, Peer Reviewed Papers from the 11th International Congress Molded Interconnect Devices (MID 2014), September 24-25, 2014, Nuremberg / Fuerth, Germany. TTP, 2014.