International Congress Molded Interconnect Devices Nuremberg / Fuerth, Germany, & Franke, J. (2014). 11th international congress molded interconnect devices: Scientific proceedings : selected, peer reviewed papers from the 11th International Congress Molded Interconnect Devices (MID 2014), September 24-25, 2014, Nuremberg / Fuerth, Germany. TTP.
शिकागो शैली (17वां संस्करण) प्रशस्ति पत्रInternational Congress Molded Interconnect Devices Nuremberg / Fuerth, Germany, और Jörg Franke. 11th International Congress Molded Interconnect Devices: Scientific Proceedings : Selected, Peer Reviewed Papers from the 11th International Congress Molded Interconnect Devices (MID 2014), September 24-25, 2014, Nuremberg / Fuerth, Germany. Pfaffikon, Switzerland: TTP, 2014.
एमएलए (9वां संस्करण) प्रशस्ति पत्रInternational Congress Molded Interconnect Devices Nuremberg / Fuerth, Germany, और Jörg Franke. 11th International Congress Molded Interconnect Devices: Scientific Proceedings : Selected, Peer Reviewed Papers from the 11th International Congress Molded Interconnect Devices (MID 2014), September 24-25, 2014, Nuremberg / Fuerth, Germany. TTP, 2014.