Design and modeling for 3D ICs and interposers /
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Main Author: | Swaminathan, Madhavan |
---|---|
Other Authors: | Han, Ki Jin |
Format: | Electronic eBook |
Language: | English |
Published: |
Singapore ; Hackensack, New Jersey :
World Scientific Publishing Company,
[2014]
|
Series: | WSPC series in advanced integration and packaging ;
v. 2. |
Subjects: | |
Online Access: | An electronic book accessible through the World Wide Web; click to view |
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