Future Trends in Microelectronics frontiers and innovations /

Advanced micro-device engineering IV : selected, peer reviewed papers from the 4th International Conference on Advanced Micro-Device Engineering (AMDE 2012), December 7, 2012, Kiryu City Performing Arts Center, Kiryu, Japan /
Опубліковано: (2014)

Micro nano devices, structure and computing systems III : selected, peer reviewed papers from the 2014 3rd International Conference on Micro Nano Devices, Structure and Computing Systems (MNDSCS 2014), March 1-2, 2014, Singapore /
Опубліковано: (2014)

Quantum, nano, micro technologies and applied researches : selected, peer reviewed papers from the 2013 2nd International Symposium on Quantum, Nano and Micro Technologies (ISQNM 2013), December 1-2, 2013, Singapore /
Опубліковано: (2014)

Enabling technologies for MEMS and nanodevices advanced micro and nanosystems /
Опубліковано: (2013)

Microelectromechanical systems advanced materials and fabrication methods /
Опубліковано: (1997)

System-level design with Rosetta
за авторством: Alexander, Perry
Опубліковано: (2007)

Vacuum nanoelectronic devices : novel electron sources and applications /
за авторством: Evtukh, Anatoliy
Опубліковано: (2015)

Hermeticity testing of MEMS and microelectronic packages /
за авторством: Costello, Suzanne, та інші
Опубліковано: (2013)

Adhesion in microelectronics /
Опубліковано: (2014)

Inkjet-based micromanufacturing
Опубліковано: (2012)

Modeling and simulation for microelectronic packaging assembly manufacturing, reliability and testing /
за авторством: Liu, S. (Sheng), 1963-
Опубліковано: (2011)

Microelectronic circuit design /
за авторством: Jaeger, Richard C.
Опубліковано: (2006)

VLSI custom microelectronics digital, analog, and mixed-signal /
за авторством: Hurst, S. L. (Stanley Leonard)
Опубліковано: (1999)

Microelectronic failure analysis desk reference.
Опубліковано: (2002)

Microelectronics failure analysis desk reference /
Опубліковано: (2011)

Microelectronic failure analysis desk reference : 2001 supplement /
Опубліковано: (2001)

Silicon science and advanced micro-device engineering II selected, peer reviewed papers from the 6th International Symposium on Silicon Science and 2nd International Conference on Advanced Micro-Device Engineering (ISSS&AMDE 2010), December 9-10, 2010, Kiryu City Performing Arts Center, Kiryu, Japan /
Опубліковано: (2012)

Silicon science and advanced micro-device engineering I selected, peer reviewed papers from the 5th International Symposium on Silicon Science and the 1st International Conference on Advanced Micro-Device Engineering (ISSS & AMDE 2009), was held by the International Education and Research Center for Silicon Science and the Advanced Technology Research Center (ATEC), Gunma University on 10 and 11 December 2009 in Kiryu, Japan /
Опубліковано: (2011)

Microwave and millimeter-wave electronic packaging /
за авторством: Sturdivant, Rick
Опубліковано: (2014)

Spin injection and transport in magnetoelectronics : proceedings of the International Symposium "Spin Injection and Transport in Magnetoelectronics" of the Forum on New Materials, part of CIMTEC 2006 - 11th International Ceramics Congress and 4th Forum on New Materials, held in Acireale, Sicily, Italy on June 4-9, 2006 /
Опубліковано: (2006)

Technology evolution for silicon nano-electronics selected, peer reviewed papers from the proceedings of the International Symposium on Technology Evolution for Silicon Nano-Electronics 2010, June 3-5, 2010, Tokyo Institute of Technology, Tokyo, Japan /
Опубліковано: (2011)

Advanced high speed devices
Опубліковано: (2010)

Advanced semiconductor devices proceedings of the 2006 Lester Eastman Conference, Cornell, Ithaca, NY, USA, 26 August 2006 /
Опубліковано: (2007)

High performance devices proceedings of the 2004 IEEE Lester Eastman Conference on High Performance Devices, Rensselaer Polytechnic Institute, 4-6 August 2004 /
Опубліковано: (2005)

Frontiers in electronics : advanced modeling in nanoscale electron devices /
Опубліковано: (2014)

Beam technologies for integrated processing report of the Committee on Beam Technologies: Opportunities in Attaining Fully-Integrated Processing Systems, National Materials Advisory Board, Commission on Engineering and Technical Systems, National Research Council.
Опубліковано: (1992)

Components, packaging and manufacturing technology II : selected, peer reviewed papers from the 2013 3rd International Conference on Packaging and Manufacturing Technology (ICCPMT 2013), December 31, 2013 - January 2, 2014, Brisbane Australia /
Опубліковано: (2014)

Spintronics for next generation innovative devices /
Опубліковано: (2015)

Atomic layer deposition principles, characteristics, and nanotechnology applications /
за авторством: Kaariainen, Tommi
Опубліковано: (2013)

Portable consumer electronics packaging, materials, and reliability /
за авторством: Canumalla, Sridhar
Опубліковано: (2010)

Design and fabrication of self-powered micro-harvesters : rotating and vibrated micro-power systems /
за авторством: Pan, C. T., та інші
Опубліковано: (2014)

Plasma processing of materials scientific opportunities and technological challenges /
Опубліковано: (1991)

Sputtering materials for VLSI and thin film devices /
за авторством: Sarkar, Jaydeep
Опубліковано: (2014)

One-dimensional nanostructures principles and applications /
Опубліковано: (2013)

One-dimensional superconductivity in nanowires
за авторством: Altomare, Fabio
Опубліковано: (2013)

Development of memristor based circuits
за авторством: Iu, Herbert Ho-Ching
Опубліковано: (2013)