Future Trends in Microelectronics frontiers and innovations /

Advanced micro-device engineering IV : selected, peer reviewed papers from the 4th International Conference on Advanced Micro-Device Engineering (AMDE 2012), December 7, 2012, Kiryu City Performing Arts Center, Kiryu, Japan /
Опубликовано: (2014)

Micro nano devices, structure and computing systems III : selected, peer reviewed papers from the 2014 3rd International Conference on Micro Nano Devices, Structure and Computing Systems (MNDSCS 2014), March 1-2, 2014, Singapore /
Опубликовано: (2014)

Quantum, nano, micro technologies and applied researches : selected, peer reviewed papers from the 2013 2nd International Symposium on Quantum, Nano and Micro Technologies (ISQNM 2013), December 1-2, 2013, Singapore /
Опубликовано: (2014)

Enabling technologies for MEMS and nanodevices advanced micro and nanosystems /
Опубликовано: (2013)

Microelectromechanical systems advanced materials and fabrication methods /
Опубликовано: (1997)

System-level design with Rosetta
по: Alexander, Perry
Опубликовано: (2007)

Vacuum nanoelectronic devices : novel electron sources and applications /
по: Evtukh, Anatoliy
Опубликовано: (2015)

Hermeticity testing of MEMS and microelectronic packages /
по: Costello, Suzanne, и др.
Опубликовано: (2013)

Adhesion in microelectronics /
Опубликовано: (2014)

Inkjet-based micromanufacturing
Опубликовано: (2012)

Modeling and simulation for microelectronic packaging assembly manufacturing, reliability and testing /
по: Liu, S. (Sheng), 1963-
Опубликовано: (2011)

Microelectronic circuit design /
по: Jaeger, Richard C.
Опубликовано: (2006)

VLSI custom microelectronics digital, analog, and mixed-signal /
по: Hurst, S. L. (Stanley Leonard)
Опубликовано: (1999)

Microelectronic failure analysis desk reference.
Опубликовано: (2002)

Microelectronics failure analysis desk reference /
Опубликовано: (2011)

Microelectronic failure analysis desk reference : 2001 supplement /
Опубликовано: (2001)

Silicon science and advanced micro-device engineering I selected, peer reviewed papers from the 5th International Symposium on Silicon Science and the 1st International Conference on Advanced Micro-Device Engineering (ISSS & AMDE 2009), was held by the International Education and Research Center for Silicon Science and the Advanced Technology Research Center (ATEC), Gunma University on 10 and 11 December 2009 in Kiryu, Japan /
Опубликовано: (2011)

Silicon science and advanced micro-device engineering II selected, peer reviewed papers from the 6th International Symposium on Silicon Science and 2nd International Conference on Advanced Micro-Device Engineering (ISSS&AMDE 2010), December 9-10, 2010, Kiryu City Performing Arts Center, Kiryu, Japan /
Опубликовано: (2012)

Microwave and millimeter-wave electronic packaging /
по: Sturdivant, Rick
Опубликовано: (2014)

Spin injection and transport in magnetoelectronics : proceedings of the International Symposium "Spin Injection and Transport in Magnetoelectronics" of the Forum on New Materials, part of CIMTEC 2006 - 11th International Ceramics Congress and 4th Forum on New Materials, held in Acireale, Sicily, Italy on June 4-9, 2006 /
Опубликовано: (2006)

Technology evolution for silicon nano-electronics selected, peer reviewed papers from the proceedings of the International Symposium on Technology Evolution for Silicon Nano-Electronics 2010, June 3-5, 2010, Tokyo Institute of Technology, Tokyo, Japan /
Опубликовано: (2011)

Advanced high speed devices
Опубликовано: (2010)

Advanced semiconductor devices proceedings of the 2006 Lester Eastman Conference, Cornell, Ithaca, NY, USA, 26 August 2006 /
Опубликовано: (2007)

High performance devices proceedings of the 2004 IEEE Lester Eastman Conference on High Performance Devices, Rensselaer Polytechnic Institute, 4-6 August 2004 /
Опубликовано: (2005)

Frontiers in electronics : advanced modeling in nanoscale electron devices /
Опубликовано: (2014)

Beam technologies for integrated processing report of the Committee on Beam Technologies: Opportunities in Attaining Fully-Integrated Processing Systems, National Materials Advisory Board, Commission on Engineering and Technical Systems, National Research Council.
Опубликовано: (1992)

Components, packaging and manufacturing technology II : selected, peer reviewed papers from the 2013 3rd International Conference on Packaging and Manufacturing Technology (ICCPMT 2013), December 31, 2013 - January 2, 2014, Brisbane Australia /
Опубликовано: (2014)

Atomic layer deposition principles, characteristics, and nanotechnology applications /
по: Kaariainen, Tommi
Опубликовано: (2013)

Spintronics for next generation innovative devices /
Опубликовано: (2015)

Portable consumer electronics packaging, materials, and reliability /
по: Canumalla, Sridhar
Опубликовано: (2010)

Design and fabrication of self-powered micro-harvesters : rotating and vibrated micro-power systems /
по: Pan, C. T., и др.
Опубликовано: (2014)

Plasma processing of materials scientific opportunities and technological challenges /
Опубликовано: (1991)

Sputtering materials for VLSI and thin film devices /
по: Sarkar, Jaydeep
Опубликовано: (2014)

Analog circuit design
Опубликовано: (2013)

Spin-crossover materials properties and applications /
Опубликовано: (2013)

One-dimensional nanostructures principles and applications /
Опубликовано: (2013)