Future Trends in Microelectronics frontiers and innovations /

Advanced micro-device engineering IV : selected, peer reviewed papers from the 4th International Conference on Advanced Micro-Device Engineering (AMDE 2012), December 7, 2012, Kiryu City Performing Arts Center, Kiryu, Japan /
Publicado em: (2014)

Micro nano devices, structure and computing systems III : selected, peer reviewed papers from the 2014 3rd International Conference on Micro Nano Devices, Structure and Computing Systems (MNDSCS 2014), March 1-2, 2014, Singapore /
Publicado em: (2014)

Quantum, nano, micro technologies and applied researches : selected, peer reviewed papers from the 2013 2nd International Symposium on Quantum, Nano and Micro Technologies (ISQNM 2013), December 1-2, 2013, Singapore /
Publicado em: (2014)

Enabling technologies for MEMS and nanodevices advanced micro and nanosystems /
Publicado em: (2013)

Microelectromechanical systems advanced materials and fabrication methods /
Publicado em: (1997)

System-level design with Rosetta
por: Alexander, Perry
Publicado em: (2007)

Vacuum nanoelectronic devices : novel electron sources and applications /
por: Evtukh, Anatoliy
Publicado em: (2015)

Hermeticity testing of MEMS and microelectronic packages /
por: Costello, Suzanne, et al.
Publicado em: (2013)

Adhesion in microelectronics /
Publicado em: (2014)

Inkjet-based micromanufacturing
Publicado em: (2012)

Modeling and simulation for microelectronic packaging assembly manufacturing, reliability and testing /
por: Liu, S. (Sheng), 1963-
Publicado em: (2011)

Microelectronic circuit design /
por: Jaeger, Richard C.
Publicado em: (2006)

VLSI custom microelectronics digital, analog, and mixed-signal /
por: Hurst, S. L. (Stanley Leonard)
Publicado em: (1999)

Microelectronic failure analysis desk reference.
Publicado em: (2002)

Microelectronics failure analysis desk reference /
Publicado em: (2011)

Microelectronic failure analysis desk reference : 2001 supplement /
Publicado em: (2001)

Silicon science and advanced micro-device engineering II selected, peer reviewed papers from the 6th International Symposium on Silicon Science and 2nd International Conference on Advanced Micro-Device Engineering (ISSS&AMDE 2010), December 9-10, 2010, Kiryu City Performing Arts Center, Kiryu, Japan /
Publicado em: (2012)

Silicon science and advanced micro-device engineering I selected, peer reviewed papers from the 5th International Symposium on Silicon Science and the 1st International Conference on Advanced Micro-Device Engineering (ISSS & AMDE 2009), was held by the International Education and Research Center for Silicon Science and the Advanced Technology Research Center (ATEC), Gunma University on 10 and 11 December 2009 in Kiryu, Japan /
Publicado em: (2011)

Microwave and millimeter-wave electronic packaging /
por: Sturdivant, Rick
Publicado em: (2014)

Spin injection and transport in magnetoelectronics : proceedings of the International Symposium "Spin Injection and Transport in Magnetoelectronics" of the Forum on New Materials, part of CIMTEC 2006 - 11th International Ceramics Congress and 4th Forum on New Materials, held in Acireale, Sicily, Italy on June 4-9, 2006 /
Publicado em: (2006)

Technology evolution for silicon nano-electronics selected, peer reviewed papers from the proceedings of the International Symposium on Technology Evolution for Silicon Nano-Electronics 2010, June 3-5, 2010, Tokyo Institute of Technology, Tokyo, Japan /
Publicado em: (2011)

Advanced high speed devices
Publicado em: (2010)

Advanced semiconductor devices proceedings of the 2006 Lester Eastman Conference, Cornell, Ithaca, NY, USA, 26 August 2006 /
Publicado em: (2007)

High performance devices proceedings of the 2004 IEEE Lester Eastman Conference on High Performance Devices, Rensselaer Polytechnic Institute, 4-6 August 2004 /
Publicado em: (2005)

Frontiers in electronics : advanced modeling in nanoscale electron devices /
Publicado em: (2014)

Beam technologies for integrated processing report of the Committee on Beam Technologies: Opportunities in Attaining Fully-Integrated Processing Systems, National Materials Advisory Board, Commission on Engineering and Technical Systems, National Research Council.
Publicado em: (1992)

Components, packaging and manufacturing technology II : selected, peer reviewed papers from the 2013 3rd International Conference on Packaging and Manufacturing Technology (ICCPMT 2013), December 31, 2013 - January 2, 2014, Brisbane Australia /
Publicado em: (2014)

Atomic layer deposition principles, characteristics, and nanotechnology applications /
por: Kaariainen, Tommi
Publicado em: (2013)

Spintronics for next generation innovative devices /
Publicado em: (2015)

Portable consumer electronics packaging, materials, and reliability /
por: Canumalla, Sridhar
Publicado em: (2010)

Design and fabrication of self-powered micro-harvesters : rotating and vibrated micro-power systems /
por: Pan, C. T., et al.
Publicado em: (2014)

Plasma processing of materials scientific opportunities and technological challenges /
Publicado em: (1991)

Sputtering materials for VLSI and thin film devices /
por: Sarkar, Jaydeep
Publicado em: (2014)

Nanoimprint technology nanotransfer for thermoplastic and photocurable polymer /
Publicado em: (2013)

One-dimensional nanostructures principles and applications /
Publicado em: (2013)

Development of memristor based circuits
por: Iu, Herbert Ho-Ching
Publicado em: (2013)