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Handbook of wafer bonding

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Bibliografiske detaljer
Institution som forfatter:	ebrary, Inc
Andre forfattere:	Ramm, Peter, Lu, James Jian-Qiang, Taklo, Maaike M. V.
Format:	Electronisk eBog
Sprog:	engelsk
Udgivet:	Weinheim, Germany : Wiley-VCH, 2012.
Fag:	Semiconductors > Bonding > Handbooks, manuals, etc. Semiconductor wafers. Microelectromechanical systems > Design and construction. Electronic books.
Online adgang:	An electronic book accessible through the World Wide Web; click to view
Tags:	Tilføj Tag Ingen Tags, Vær først til at tagge denne postø!

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CMOS circuit design for RF sensors
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