Modeling and simulation for microelectronic packaging assembly manufacturing, reliability and testing /

"This book is primarily concerned with studies of electronic packaging in assembly manufacture processes and failure mechanisms in assembly manufacture processes and tests through modeling and simulation"--

Detaylı Bibliyografya

Yazar:	Liu, S. (Sheng), 1963-
Müşterek Yazar:	ebrary, Inc
Diğer Yazarlar:	Liu, Yong, 1962-
Materyal Türü:	Elektronik Ekitap
Dil:	İngilizce
Baskı/Yayın Bilgisi:	Hoboken, N.J. : Wiley, 2011.
Konular:	Microelectronic packaging > Simulation methods. Electronic books.
Online Erişim:	An electronic book accessible through the World Wide Web; click to view
Etiketler:	Etiketle Etiket eklenmemiş, İlk siz ekleyin!