Modeling and simulation for microelectronic packaging assembly manufacturing, reliability and testing /

"This book is primarily concerned with studies of electronic packaging in assembly manufacture processes and failure mechanisms in assembly manufacture processes and tests through modeling and simulation"--

Detalles Bibliográficos

Autor Principal:	Liu, S. (Sheng), 1963-
Autor Corporativo:	ebrary, Inc
Outros autores:	Liu, Yong, 1962-
Formato:	Electrónico eBook
Idioma:	inglés
Publicado:	Hoboken, N.J. : Wiley, 2011.
Subjects:	Microelectronic packaging > Simulation methods. Electronic books.
Acceso en liña:	An electronic book accessible through the World Wide Web; click to view
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