Modeling and simulation for microelectronic packaging assembly manufacturing, reliability and testing /

"This book is primarily concerned with studies of electronic packaging in assembly manufacture processes and failure mechanisms in assembly manufacture processes and tests through modeling and simulation"--

Xehetasun bibliografikoak

Egile nagusia:	Liu, S. (Sheng), 1963-
Erakunde egilea:	ebrary, Inc
Beste egile batzuk:	Liu, Yong, 1962-
Formatua:	Baliabide elektronikoa eBook
Hizkuntza:	ingelesa
Argitaratua:	Hoboken, N.J. : Wiley, 2011.
Gaiak:	Microelectronic packaging > Simulation methods. Electronic books.
Sarrera elektronikoa:	An electronic book accessible through the World Wide Web; click to view
Etiketak:	Etiketa erantsi Etiketarik gabe, Izan zaitez lehena erregistro honi etiketa jartzen!