Modeling and simulation for microelectronic packaging assembly manufacturing, reliability and testing /

"This book is primarily concerned with studies of electronic packaging in assembly manufacture processes and failure mechanisms in assembly manufacture processes and tests through modeling and simulation"--

Bibliographische Detailangaben

1. Verfasser:	Liu, S. (Sheng), 1963-
Körperschaft:	ebrary, Inc
Weitere Verfasser:	Liu, Yong, 1962-
Format:	Elektronisch E-Book
Sprache:	Englisch
Veröffentlicht:	Hoboken, N.J. : Wiley, 2011.
Schlagworte:	Microelectronic packaging > Simulation methods. Electronic books.
Online-Zugang:	An electronic book accessible through the World Wide Web; click to view
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