Modeling and simulation for microelectronic packaging assembly manufacturing, reliability and testing /
"This book is primarily concerned with studies of electronic packaging in assembly manufacture processes and failure mechanisms in assembly manufacture processes and tests through modeling and simulation"--
I tiakina i:
| Kaituhi matua: | |
|---|---|
| Kaituhi rangatōpū: | |
| Ētahi atu kaituhi: | |
| Hōputu: | Tāhiko īPukapuka |
| Reo: | Ingarihi |
| I whakaputaina: |
Hoboken, N.J. :
Wiley,
2011.
|
| Ngā marau: | |
| Urunga tuihono: | An electronic book accessible through the World Wide Web; click to view |
| Ngā Tūtohu: |
Tāpirihia he Tūtohu
Kāore He Tūtohu, Me noho koe te mea tuatahi ki te tūtohu i tēnei pūkete!
|
Rārangi ihirangi:
- pt. 1. Mechanics and modeling
- pt. 2. Modeling in microelectronic packaging and assembly
- pt. 3. Modeling in microelectronic package reliability and test
- pt. 4. Modern modeling and simulation methodologies : application to nano packaging.