Modeling and simulation for microelectronic packaging assembly manufacturing, reliability and testing /
"This book is primarily concerned with studies of electronic packaging in assembly manufacture processes and failure mechanisms in assembly manufacture processes and tests through modeling and simulation"--
保存先:
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| フォーマット: | 電子媒体 eBook |
| 言語: | 英語 |
| 出版事項: |
Hoboken, N.J. :
Wiley,
2011.
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| 主題: | |
| オンライン･アクセス: | An electronic book accessible through the World Wide Web; click to view |
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目次:
- pt. 1. Mechanics and modeling
- pt. 2. Modeling in microelectronic packaging and assembly
- pt. 3. Modeling in microelectronic package reliability and test
- pt. 4. Modern modeling and simulation methodologies : application to nano packaging.