Modeling and simulation for microelectronic packaging assembly manufacturing, reliability and testing /
"This book is primarily concerned with studies of electronic packaging in assembly manufacture processes and failure mechanisms in assembly manufacture processes and tests through modeling and simulation"--
Guardat en:
| Autor principal: | |
|---|---|
| Autor corporatiu: | |
| Altres autors: | |
| Format: | Electrònic eBook |
| Idioma: | anglès |
| Publicat: |
Hoboken, N.J. :
Wiley,
2011.
|
| Matèries: | |
| Accés en línia: | An electronic book accessible through the World Wide Web; click to view |
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