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Modeling and simulation for microelectronic packaging assembly manufacturing, reliability and testing /

"This book is primarily concerned with studies of electronic packaging in assembly manufacture processes and failure mechanisms in assembly manufacture processes and tests through modeling and simulation"--

Збережено в:

Бібліографічні деталі
Автор:	Liu, S. (Sheng), 1963-
Співавтор:	ebrary, Inc
Інші автори:	Liu, Yong, 1962-
Формат:	Електронний ресурс eКнига
Мова:	Англійська
Опубліковано:	Hoboken, N.J. : Wiley, 2011.
Предмети:	Microelectronic packaging > Simulation methods. Electronic books.
Онлайн доступ:	An electronic book accessible through the World Wide Web; click to view
Теги:	Додати тег Немає тегів, Будьте першим, хто поставить тег для цього запису!

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