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Modeling and simulation for microelectronic packaging assembly manufacturing, reliability and testing /

"This book is primarily concerned with studies of electronic packaging in assembly manufacture processes and failure mechanisms in assembly manufacture processes and tests through modeling and simulation"--

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Bibliográfalaš dieđut
Váldodahkki:	Liu, S. (Sheng), 1963-
Searvvušdahkki:	ebrary, Inc
Eará dahkkit:	Liu, Yong, 1962-
Materiálatiipa:	Elektrovnnalaš E-girji
Giella:	eaŋgalasgiella
Almmustuhtton:	Hoboken, N.J. : Wiley, 2011.
Fáttát:	Microelectronic packaging > Simulation methods. Electronic books.
Liŋkkat:	An electronic book accessible through the World Wide Web; click to view
Fáddágilkorat:	Lasit fáddágilkoriid Eai fáddágilkorat, Lasit vuosttaš fáddágilkora!

Geahča maid

Microwave and millimeter-wave electronic packaging /
Dahkki: Sturdivant, Rick
Almmustuhtton: (2014)

Adhesion in microelectronics /
Almmustuhtton: (2014)

Portable consumer electronics packaging, materials, and reliability /
Dahkki: Canumalla, Sridhar
Almmustuhtton: (2010)

Lead-free solder interconnect reliability
Almmustuhtton: (2005)

Advanced manufacturing process, lead free interconnect materials and reliability modeling for electronics packaging
Almmustuhtton: (2006)

Materials for high-density electronic packaging and interconnection report of the Committee on Materials for High-Density Electronic Packaging, National Materials Advisory Board, Commission on Engineering and Technical Systems, National Research Council.
Almmustuhtton: (1990)

Hermeticity testing of MEMS and microelectronic packages /
Dahkki: Costello, Suzanne, et al.
Almmustuhtton: (2013)

Components, packaging and manufacturing technology II : selected, peer reviewed papers from the 2013 3rd International Conference on Packaging and Manufacturing Technology (ICCPMT 2013), December 31, 2013 - January 2, 2014, Brisbane Australia /
Almmustuhtton: (2014)

LED packaging for lighting applications design, manufacturing, and testing /
Dahkki: Liu, S. (Sheng), 1963-
Almmustuhtton: (2011)

LCP for microwave packages and modules
Almmustuhtton: (2012)

Boundary-scan interconnect diagnosis
Dahkki: Sousa, José T. de
Almmustuhtton: (2001)

Chemistry in microelectronics
Almmustuhtton: (2013)

Understanding microelectronics a top-down approach /
Dahkki: Maloberti, F. (Franco)
Almmustuhtton: (2012)

Packaging technology fundamentals, materials and processes /
Almmustuhtton: (2012)

Future Trends in Microelectronics frontiers and innovations /
Almmustuhtton: (2013)

Rigid plastics packaging materials, processes and applications /
Dahkki: Hannay, F.
Almmustuhtton: (2002)

Advances in meat, poultry and seafood packaging
Almmustuhtton: (2012)

Packaging essentials 100 design principles for creating packages /
Dahkki: Roncarelli, Sarah
Almmustuhtton: (2010)

Microelectronics, microsystems and nanotechnology papers presented at MMN 2000, Athens, Greece, 20-22 November 2000 /
Almmustuhtton: (2001)

Modeling and simulation in manufacturing and defense acquisition pathways to success /
Almmustuhtton: (2002)

Selecting colour for packaging /
Dahkki: Danger, Eric P. (Eric Paxton)
Almmustuhtton: (1987)

Research on food packaging technology : selected, peer reviewed papers from the 2013 China Academic Conference on Food Packaging, November 23-25, 2013, Tianjin, China /
Almmustuhtton: (2014)

Packaging for nonthermal processing of food
Almmustuhtton: (2007)

Biopharmaceutics modeling and simulations theory, practice, methods, and applications /
Dahkki: Sugano, Kiyohiko
Almmustuhtton: (2012)

Emerging food packaging technologies principles and practice /
Almmustuhtton: (2012)

Solar module packaging polymeric requirements and selection /
Dahkki: Poliskie, Michelle
Almmustuhtton: (2011)

System modeling and simulation
Dahkki: Singh, V. P.
Almmustuhtton: (2009)

Semiconductor packaging materials interaction and reliability /
Almmustuhtton: (2011)

Nanoparticles in active polymer food packaging /
Dahkki: Hrnjak Murgić, Zlata
Almmustuhtton: (2015)

Assessing food safety of polymer packaging
Dahkki: Vergnaud, J. M.
Almmustuhtton: (2006)

Green printing and packaging materials : selected, peer-reviewed papers from the 2011 China Academic Conference on Green Printing and Packaging Materials, August 20-23, 2011, Harbin China /
Almmustuhtton: (2012)

Future trends in microelectronics : Journey into the unknown /
Almmustuhtton: (2016)

Behavioral modeling and simulation from individuals to societies /
Almmustuhtton: (2008)

Regulation of food packaging in Europe and the USA
Dahkki: Knight, Derek J.
Almmustuhtton: (2004)

Plastic films in food packaging materials, technology, and applications /
Almmustuhtton: (2013)

Handbook of paper and paperboard packaging technology
Almmustuhtton: (2013)

Practical guide to antimicrobial active packaging /
Dahkki: Gavara, Rafael
Almmustuhtton: (2015)

Surgical simulation /
Almmustuhtton: (2014)

Simulation techniques in financial risk management /
Dahkki: Chan, Ngai Hang, et al.
Almmustuhtton: (2015)

Principles of modeling and simulation a multidisciplinary approach /
Almmustuhtton: (2009)