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Modeling and simulation for microelectronic packaging assembly manufacturing, reliability and testing /

"This book is primarily concerned with studies of electronic packaging in assembly manufacture processes and failure mechanisms in assembly manufacture processes and tests through modeling and simulation"--

Sábháilte in:

Sonraí bibleagrafaíochta
Príomhchruthaitheoir:	Liu, S. (Sheng), 1963-
Údar corparáideach:	ebrary, Inc
Rannpháirtithe:	Liu, Yong, 1962-
Formáid:	Leictreonach Ríomhleabhar
Teanga:	Béarla
Foilsithe / Cruthaithe:	Hoboken, N.J. : Wiley, 2011.
Ábhair:	Microelectronic packaging > Simulation methods. Electronic books.
Rochtain ar líne:	An electronic book accessible through the World Wide Web; click to view
Clibeanna:	Cuir clib leis Níl clibeanna ann, Bí ar an gcéad duine le clib a chur leis an taifead seo!

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