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Modeling and simulation for microelectronic packaging assembly manufacturing, reliability and testing /

"This book is primarily concerned with studies of electronic packaging in assembly manufacture processes and failure mechanisms in assembly manufacture processes and tests through modeling and simulation"--

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Détails bibliographiques
Auteur principal:	Liu, S. (Sheng), 1963-
Collectivité auteur:	ebrary, Inc
Autres auteurs:	Liu, Yong, 1962-
Format:	Électronique eBook
Langue:	anglais
Publié:	Hoboken, N.J. : Wiley, 2011.
Sujets:	Microelectronic packaging > Simulation methods. Electronic books.
Accès en ligne:	An electronic book accessible through the World Wide Web; click to view
Tags:	Ajouter un tag Pas de tags, Soyez le premier à ajouter un tag!

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