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Modeling and simulation for microelectronic packaging assembly manufacturing, reliability and testing /

"This book is primarily concerned with studies of electronic packaging in assembly manufacture processes and failure mechanisms in assembly manufacture processes and tests through modeling and simulation"--

Αποθηκεύτηκε σε:

Λεπτομέρειες βιβλιογραφικής εγγραφής
Κύριος συγγραφέας:	Liu, S. (Sheng), 1963-
Συγγραφή απο Οργανισμό/Αρχή:	ebrary, Inc
Άλλοι συγγραφείς:	Liu, Yong, 1962-
Μορφή:	Ηλεκτρονική πηγή Ηλ. βιβλίο
Γλώσσα:	Αγγλικά
Έκδοση:	Hoboken, N.J. : Wiley, 2011.
Θέματα:	Microelectronic packaging > Simulation methods. Electronic books.
Διαθέσιμο Online:	An electronic book accessible through the World Wide Web; click to view
Ετικέτες:	Προσθήκη ετικέτας Δεν υπάρχουν, Καταχωρήστε ετικέτα πρώτοι!

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Materials for high-density electronic packaging and interconnection report of the Committee on Materials for High-Density Electronic Packaging, National Materials Advisory Board, Commission on Engineering and Technical Systems, National Research Council.
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Surgical simulation /
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